Samsung pioneers 2.3D semiconductor packaging for AI chips, challenging Intel and TSMC.
Samsung's breakthrough 2.3D tech for high-performance semiconductors, particularly AI chips.
Ready for mass production, Samsung's 2.3D packaging competes with industry giants.
Silicon interposer replaced with a revolutionary 'silicon bridge' in Samsung's tech.
Silicon bridge strategically inserted into essential areas, optimizing semiconductor packaging.
Major companies express interest as Samsung gears up for mass production.
Kim Gu-young, Samsung Electronics AVP, reveals plans for mass production infrastructure by next year.
Samsung's innovation reduces costs by 22% without compromising performance.
Semiconductor chip package with 12 HBMs key to Samsung's cost-effective approach.
Bridge-based method hailed as "2.3D packaging" in the semiconductor industry.
Samsung establishes a vital foothold in the competitive AI semiconductor landscape.
The future of semiconductor technology: Samsung's 2.3D packaging sets a new standard.